| 摘要 |
PURPOSE:To reduce frictional force with a case, to remove the slip of a collet and a semiconductor element and to prevent the breaking and flaw of the semiconductor element by installing an electromagnet for applying slight vibrations before vibrations by the use of a cam are applied to the collet to a die bonding arm section. CONSTITUTION:An electromagnet 1 is mounted to a die bonding arm section 2. A semiconductor element 4 is carried onto a gold silicon tape 5 placed on a case 6 by a collet 3, the electromagnet 1 is vibrated, the vibrations are transmitted over the semiconductor element 4, the gold silicon tape 5 and the case 6 through the die bonding arm section 2 and the collet 3, and reciprocation by the use of a cam 8 is transmitted over the semiconductor element 4. The friction of the semiconductor element and the case is reduced by previously applying preliminary vibrations by the electromagnet before main vibrations by the use of the cam. |
