| 摘要 |
PURPOSE:To prevent a fault of short-circuit of adjacent metal thin wires due to the flow of the metal thin wires on the occasion of resin sealing, by forming an insulative film of a silicon nitride film, a silicon oxide film or polyimide resin all around an inside sealed body. CONSTITUTION:An inside sealed body has a structure of the whole surface being covered completely with an insulative film 10 formed of a plasma nitride film, and it is sealed with resin 6. Therefore a bonding pad electrode 4, the lateral side 9 of a chip and the surfaces of metal thin wires 5 are covered completely with the insulative film and a sufficient blocking haredening is produced for a contamination source located outside or in the resin. Since reinforcement is made by the insulative film 10, the bend strength of the metal thin wires 5 is improved sharply, and also mutual insulation is not lost even when the adjacent metal thin wires come into contact with each other. |
