| 摘要 |
Compositions are provided which combine, in functionally stable aqueous solution form, multiple functionalities required in the fabrication of printed circuits, such as neutralizing of oxidizing species remaining on surfaces to be metallized as a result of desmearing or etch-back or other like treatment of through-holes with strong oxidizing agents, and/or micro-etching of copper surfaces to enhance adhesion thereto of electroless or electrolytic metal plating, and/or cleaning of soils, oils, etc. from copper surfaces for similar purpose, and/or conditioning through-holes to enhance and uniformize their absorption of catalyst prior to electroless metallization. These compositions enable significant reduction in the number of steps and processing time associated with conventional printed circuit fabrication, and importantly eliminate traditional intervening rinsing requirements, with consequent reduction in waste water treatment needs.
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