发明名称 Measuring electroless plating deposition speed
摘要 The speed is measured using a sensor 1 having two opposed electrodes. A sensor drive circuit 2 cyclicly applies direct voltage 11 to the sensor and from the measured current polarization resistance is determined and input a processing circuit 3 which calculates the plating deposition speed, which is displayed at 4. In a preferred embodiment, each of the sensor electrodes has an conductor and a non-conductor, with either the conductors or the non-conductors facing each other. The conductors may be copper, gold, platinum or palladium and the non-conductors an alkaliproof non-conductive material such as epoxy resin or epoxy resin of a glass base material. Preferably the direct voltage 11 is 5-20mV with an on-off cycle between 1:1 and 1:10. <IMAGE>
申请公布号 GB2250095(A) 申请公布日期 1992.05.27
申请号 GB19910021976 申请日期 1991.10.16
申请人 * HITACHI CHEMICAL COMPANY LTD;* HITACHI BORDEN CHEMICAL PRODUCTS INC 发明人 HIROYUKI * TOYODA;TAKESHI * SHIMAZAKI
分类号 G01N27/26;C23C18/16;C23C18/31;G01N17/02;G01N27/06;G01N27/416;G01N27/49 主分类号 G01N27/26
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