发明名称 |
Measuring electroless plating deposition speed |
摘要 |
The speed is measured using a sensor 1 having two opposed electrodes. A sensor drive circuit 2 cyclicly applies direct voltage 11 to the sensor and from the measured current polarization resistance is determined and input a processing circuit 3 which calculates the plating deposition speed, which is displayed at 4. In a preferred embodiment, each of the sensor electrodes has an conductor and a non-conductor, with either the conductors or the non-conductors facing each other. The conductors may be copper, gold, platinum or palladium and the non-conductors an alkaliproof non-conductive material such as epoxy resin or epoxy resin of a glass base material. Preferably the direct voltage 11 is 5-20mV with an on-off cycle between 1:1 and 1:10. <IMAGE>
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申请公布号 |
GB2250095(A) |
申请公布日期 |
1992.05.27 |
申请号 |
GB19910021976 |
申请日期 |
1991.10.16 |
申请人 |
* HITACHI CHEMICAL COMPANY LTD;* HITACHI BORDEN CHEMICAL PRODUCTS INC |
发明人 |
HIROYUKI * TOYODA;TAKESHI * SHIMAZAKI |
分类号 |
G01N27/26;C23C18/16;C23C18/31;G01N17/02;G01N27/06;G01N27/416;G01N27/49 |
主分类号 |
G01N27/26 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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