| 摘要 |
PURPOSE:To obtain a lead frame in which outer lead parts having a thickness as prescribed can be formed at the final stage even when a board for electronic-component mounting use is finished by executing various working operations to the lead frame by a method wherein a plated layer which is corrosion-resistant to an etchant or the like for a copper material is formed on the surface of the outer lead parts of individual leads composed of the copper material. CONSTITUTION:At a lead frame 10 for electronic-component mounting board use, many leads 11 which are connected electrically to an electronic component united to and mounted on an insulating base material and outer lead parts 11b of the individual leads 11 are exposed from the insulating base material or a molding resin to the outside. At the lead frame 10, a core base material 13 for the lead frame 10 is constituted of a copper material, and a plated layer 14 composed of a metal or an organic material which is corrosion-resistant to an etchant or the like for the copper material is formed on the surface of the outer lead parts 11b of at least the individual leads 11. For example, a copper material having a thickness of 0.15 to 0.25mm is adopted as a copper material for said core base material 13, and a plated layer 14 is formed by using a solder having a thickness of about 10mum or by using nickel having a thickness of about 2 to 5mum. |
