| 摘要 |
PURPOSE:To eliminate remainders of contaminated chemical liquid within a tank with shortened discharge time of the liquid by a method wherein the tank is designed in such a way that a cover on which a gas introduction pipe for pressurizing and a sealing structure which seals which seals the process tank with that cover are provided on an upper part of the process tank, and a structure is provided with which the chemical liquid is discharged while being pressurized after the wet process of a wafer is terminated. CONSTITUTION:In a process tank 1 for wet process apparatus which performs a wet process for a wafer in the semiconductor manufacturing process, the tank is provided with a cover 10 on which a pressurizing gas introduction pipe 9 is connected on an upper part of the process tank 1, and a sealing structure 12 which seals the process tank 1 with that cover 10, and chemical liquid 7 is discharged while being pressurized after the process is terminated. For example, the cover 10 on which the gas introduction pipe 9 is connected is pivoted to open and close by means of a shaft 11, and an O-ring 12 is provided on the tank 1 so that it is sealed from outside atmosphere with that cover. Then, when the chemical liquid 7 is discharged, the shaft 11 is rotated to bring the cover 10 into close contact with the O-ring 12, the gas for pressurizing is introduced from the gas introduction pipe 9, and at the same time, an air-driven valve 4 for discharging liquid is opened so that the chemical liquid can be discharged while being pressurized. |
