| 摘要 |
PURPOSE:To prevent a drop in the bonding properties of a copper circuit by carrying out water washing treatment after having conducted neutralization treatment of the surface of said copper circuit which has undergone reduction treatment of a copper oxide with hydrogen in its generation period. CONSTITUTION:A copper circuit installed to an inner layer circuit board is subjected to oxidizing treatment where a copper oxide is formed don the surface of the circuit. Then, the surface of the copper oxide is coated with a metal, which can be more easily ionized than the copper oxide. After it is coated, the coated metal is adapted to be molten with acid. At the same time, the copper oxide is reduced by the hydrogen generated in its generation period. The surface of the copper circuit is subjected to neutralization treatment with strong base and water washing treatment. This construction makes it possible to eliminate acid from the surface of the copper circuit spontaneously and prevent a drop in the bonding properties with prepreg resin since the projected and recessed parts on the surface of the copper circuit can be melted. |
