| 摘要 |
PURPOSE:To reduce the number of component parts, and also to make area small by a method wherein, after the conductive part on the insulative substrate of the electronic part, having an active part and a passive part on the front and the back sides, and the electrode on the surface opposing to the above-mentioned conductive part have been connected, the electrode on the other surface and the conductive part are connected. CONSTITUTION:A wiring conductor 2, to be used for connection and wiring, is formed on the substrate 1 consisting of the organic material, such as glass epoxy and the like having electric insulating property, or the inorgainic material such as alumina ceramic and the like, the active part 21 such as a transistor and the like is formed on the surface side of the electronic part 11 located on the substrate 1, the above- mentioned materials are protected by dielectric layers 22 and 23, and an electrode 25, to be used to connect to outside, is formed. A resistor layer 32 is formed on a dielectric layer 31 on the side of the electric part 11, and a conductor layer 33 is formed in addition to the above. After the electronic part 11 has been connected to the electrode 2 by soldering, thermo-compression bonding and the like through the intermediary of the electrode 25, the conductor 33 and an electrode 2' are connected by a metal fine wire 34 of gold and the like. |
