| 摘要 |
<p>PURPOSE:To improve the strength of an inner lead by a method wherein iron- containing alloy foil is formed on an inner-lead containing part excluding an element-mounting part, and copper foil is formed on the outer-lead containing part excluding the above-mentioned element-mounting part and the inner lead. CONSTITUTION:On the part of the table 1, excluding an element-mounting part, composed of the material of resins such as polyimide resin, polyethylene resin and the like and paper, etc., a lead 5 on which metal foil of desired pattern is banded is banded using a bonding agent and the like. The lead 5 is a double- layer clad foil consisting of the lower layer 5a and the upper layer 5b, iron- containing alloy foil is used for the part containing inner lead 51 on the lower layer 5a, and 42 alloy foil is considered suitable for the lower layer 5a. The upper layer 5b is banded to the part containing an outer lead 52 excluding the inner lead 51, and rolled foil and electrolytic copper foil are suitable for the upper layewr 5b. Through the above-mentioned procedures, the strength of the inner lead can be improved, and the deformation and cutting. generating when the inner lead 51 is connected to an Si chip in the assembling process, can be prevented.</p> |
