发明名称 |
Resin sealed semiconductor device. |
摘要 |
A resin sealed semiconductor device having: a semiconductor chip (1) having an electric circuit therein and an elongated main connection line (20) respectively formed thereon; a plurality of leads (9) disposed near the chip (1); electrical connecting wires for electrically connecting together the chip (1) and the leads (9); at least one by-pass connection line (100) formed in correspondence with the main connection line (20); and by-pass connecting wires (11) for electrically connecting the main connection line (20) near at one end thereof to the by-pass connection line (100) near at one end thereof, and electrically connecting the main connection line (20) near at the other end thereof to the by-pass connection line (100) near at the other end thereof. <IMAGE> |
申请公布号 |
EP0486027(A2) |
申请公布日期 |
1992.05.20 |
申请号 |
EP19910119460 |
申请日期 |
1991.11.14 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
KOMENAKA, KAZUICHI;ISHIKAWA, TOSHIMITSU, 902, TOSHIBA NISHIKAWAGUCHI |
分类号 |
H01L21/60;H01L23/495;H01L23/50 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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