| 摘要 |
PURPOSE:To reduce an actually-mounting area and readily cope with multiplication of pin of a connector by a method wherein an IC for an interface or a driver/receiver is so constructed as to be integrated with a connector. CONSTITUTION:A package mold part 1 is actually mounted on a printed substrate 4 and has a plurality of connector pins 2 inside. Further, a IC chip 3 for an interface or a driver/receiver is assembled inside a connector forming the part 1, and a pad of each chip is performed bonding to the pin 2, and the chip 3 is assembled by only the necessary number such as two or upper and lower steps corresponding to the number of signal line. Accordingly, the chip 3 and the connector are integrated. That is, the IC which is normally used for the interface or the driver/receiver is so constructed as to be integrated with the connector, whereby an actually-mounting area is smaller than conventionally and the construction can readily cope with multiplication of the pin of the connector. |
