FILM BONDING APPARATUS

摘要

A film bonding apparatus in which a film cut to a length corresponding to that of a base plate is bonded to the surface of the plate by the application of heat and pressure with a bonding roller. The film is provided from a continuous roll and is cut to appropriate size, the trailing edge of the film being held tightly to avoid film wrinkling or air bubbles by the suction action of an edge holding member whose effective length is not less than the maximum width of the films to be bonded by the apparatus. The holding member is moveable, at a speed equal to or slightly less than the rotative circumferential velocity of the pressure roller, the speed being automatically adjusted to maintain appropriate tension on the film. Coordinated movement between the film holding member and the pressure roller is provided by a gear mechanism.