| 摘要 |
<p>PURPOSE:To enable the semiconductor wafers to be shifted only by one linear directional movement for cutting down the shifting time by a method wherein the lower part of the carrier loading multiple semiconductor wafers is made capable of opening and closing so that multiple semiconductor wafers may be collectively shifted from the carrier lower part to the other carrier arranged on the carrier lower part using a shifting means. CONSTITUTION:A carrier 2 containing semiconductor wafers 1 is arranged on the upper part of a shifting carrier 3. Next, a holding base 4a is driven by a driving device 4b so as to be abutted against the bottom part of the semiconductor wafers 1 to be held. Next, opening and closing plates 2b, 2c are pivoted respectively in arrow A1, B1 directions for making the semiconductor wafers 1 to be perfectly held by the holding base 4a. Next, the driving device 4b is driven to lower the holding base 4a in the arrow C1 direction. At this time, multiple semiconductor wafers 1 are collectively lowered together with the descending holding base 4a since the opening and closing plates 2b, 2c are in opened state. Furthermore, when the holding base 4a descends lower than the hole part 3a of the carrier 3, the semiconductor wafers 1 are held by the carrier 3 to finish the shifting step. Through these procedures, the semiconductor wafers 1 can be shifted by moving them linearly thereby enabling the shifting time to be cut down.</p> |
