发明名称 LASER CUTTING METHOD
摘要 PURPOSE:To stabilize the quality of a cut surface by measuring the concn. of the evaporating gas generated at the time of cutting and maintaining optimum processing conditions even if the processing conditions vary during cutting. CONSTITUTION:The temp. of the intrinsic evaporating gas 11 which is possessed by a material 7 to be cut and is generated at the time of cutting is continuously measured by a gas concn. detector 15 and the difference from the gas concn. under preset optimum conditions is decided. The optimum processing conditions are then maintained. The quality of the cut surface is stabilized always to specified quality.
申请公布号 JPH04143088(A) 申请公布日期 1992.05.18
申请号 JP19900267366 申请日期 1990.10.03
申请人 MITSUBISHI ELECTRIC CORP 发明人 YOSHIZUMI YASUJI;KURIHARA HIDEO
分类号 B23K26/00;B23K26/02;B23K26/04;B23K26/16;B23K26/40 主分类号 B23K26/00
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