发明名称 PACKAGE FOR SEMICONDUCTOR DEVICE
摘要 PURPOSE:To allow lots of signal lines to be arranged with high density by arranging plural signal lines in parallel with each other and in a zigzag way vertically to a package main body inserted between two upper and lower ground layers while the characteristic impedance of the signal lines is matched with a prescribed value. CONSTITUTION:Plural stripe signal lines 50 each having a uniformed width, a uniformed thickness and a uniformed cross sectional shape are arranged to a package main body 10a made of an insulator 40 inserted between two upper and lower parallel ground layers 12a, 12b in a way that the signal lines 50 have no gap, side ridges of the adjacent signal lines 50 are not overlapped with each other, in parallel with each other at a plane view, and in a zigzag way vertically alternately at a side view. Moreover, the plural signal Lines 50 are arranged in parallel with the ground layers 12a, 12b, in a zigzag way vertically alternately at a side view to the package main body 10a made of the insulator 40 inserted between the two upper and lower parallel ground layers 12a, 12b so that each characteristic impedance of all the signal lines 50 is matched with a prescribed value (50ohms).
申请公布号 JPH04144301(A) 申请公布日期 1992.05.18
申请号 JP19900268171 申请日期 1990.10.04
申请人 SHINKO ELECTRIC IND CO LTD 发明人 ICHIKAWA KEIICHI;MIYAGAWA FUMIO
分类号 H01L23/12;H01P1/00;H01P3/08;H01P5/02;H01P5/08 主分类号 H01L23/12
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