发明名称 |
Hollow fine particle composition. |
摘要 |
<p>The present invention relates to a composition comprising hollow fine particles wetted with a liquid organic compound not dissolving the particles, and to a method of preparing the hollow fine particles, in which thermally expandable microspheres are heated in the liquid organic compound not dissloving the particles; said hollow fine particles are substantially not agglomerated and can be easily and homogenously compounded with a plastics, coatings, rubber, sealant and the like. <IMAGE></p> |
申请公布号 |
EP0484893(A2) |
申请公布日期 |
1992.05.13 |
申请号 |
EP19910118889 |
申请日期 |
1991.11.06 |
申请人 |
MATSUMOTO YUSHI-SEIYAKU CO., LTD. |
发明人 |
TANAKA, KOJI;KITANO, KENICHI;KIDA, SUEO |
分类号 |
C08J9/16;C08J3/12;C08J9/22;C08J9/32 |
主分类号 |
C08J9/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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