发明名称 Hollow fine particle composition.
摘要 <p>The present invention relates to a composition comprising hollow fine particles wetted with a liquid organic compound not dissolving the particles, and to a method of preparing the hollow fine particles, in which thermally expandable microspheres are heated in the liquid organic compound not dissloving the particles; said hollow fine particles are substantially not agglomerated and can be easily and homogenously compounded with a plastics, coatings, rubber, sealant and the like. &lt;IMAGE&gt;</p>
申请公布号 EP0484893(A2) 申请公布日期 1992.05.13
申请号 EP19910118889 申请日期 1991.11.06
申请人 MATSUMOTO YUSHI-SEIYAKU CO., LTD. 发明人 TANAKA, KOJI;KITANO, KENICHI;KIDA, SUEO
分类号 C08J9/16;C08J3/12;C08J9/22;C08J9/32 主分类号 C08J9/16
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