| 摘要 |
PURPOSE:To obtain complete electric continuity of a through hole part, by bringing one side lands of thermoplastic resin film base bodies into contact with each other, and electrically connecting them via a conducting layer wherein thermoplastic resin formed on the inner wall surface of a previously bored hole is used as binder. CONSTITUTION:A hole 15a penetrating from the surface to the rear is bored at desired positions of thermoplastic resin films 11-14. Conductive silver paste wherein thermoplastic resin is used as binder is stuck on the inner wall surface of the hole 15a, thereby forming a conducting layer 15b. A through hole 15 is formed in this manner. A circuit pattern 16 is printed on at least one main surface out of the films 11, 12, 13, 14. Lands 17 being continuous with the circuit pattern 16 are formed on both surfaces of the films being continuos with the through hole 15 by using conductive paste. The films 11, 12, 13, 14 are so laminated that the specified circuit pattern 16 of the film 14 as the lowermost layer is positioned under the through hole 15, and fusion bonded in a unified body by heat-pressure molding with a heat press. A part of conductive paste constituting the circuit pattern 16 is fused, fluidized, and forcibly inserted in the through hole 15. |
