发明名称 |
THIN FILM HEAD SLIDER FABRICATION PROCESS |
摘要 |
In an improved process for fabricating thin film head sliders (10) from a wafer (26) on one face of which a plurality of electromagnetic devices (22) are arranged in rows, a single-row bar (28) is mechanically processed to form sliders while it remains an integral part of the wafer, or after it is bonded to a fixture (50) under a condition which induces no bow on the bar. Alternatively, a double-row bar sliced from the wafer is used for fabrication of sliders, wherein each single-row bar is mechanically processed while it remains an integral part of the double-row bar, or after it is bonded to a fixture as an integral part of a double-row bar followed by severance of the bonded double-row bar into two single-row bars. The process eliminates or materially reduces any inducement of bow of the bar, which is a serious cause of throat height control problem associated with the prior fabrication methods. <IMAGE> |
申请公布号 |
EP0463765(A3) |
申请公布日期 |
1992.05.13 |
申请号 |
EP19910305226 |
申请日期 |
1991.06.11 |
申请人 |
DIGITAL EQUIPMENT CORPORATION |
发明人 |
HUSSINGER, KEITH R.;MALLARY, MICHAEL L. |
分类号 |
G11B5/127;G11B5/187;G11B5/31;G11B5/60;(IPC1-7):G11B5/127 |
主分类号 |
G11B5/127 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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