| 摘要 |
Pressure-contact electrodes 3, 4 are mounted through insulating sheets 5, 6 on a metal substrate 2 having semiconductor elements such as MOSFETS mounted thereon. The electrodes are wire-bonded to the terminals of the semiconductor elements. The flexible insulating sheets are inserted between the metal substrate 2 and the electrode 3 and between the electrodes 3, 4 respectively. The insulating sheets are fixed onto the metal substrate and the electrodes through an adhesive 7. <IMAGE> |
