PROCESS FOR THE REMOVAL OF AN EMBEDDING BODY FROM THE EMBEDDED COMPONENT

摘要

A process and an arrangement are disclosed for the removal of a low-melting embedding body from a higher-melting embedded component. A groove is provided along a molding-in base of the component and by means of the widening of the groove via heatable elements, the resulting halves of the embedding body are removed. The process and the arrangement are particularly suitable for separating embedded guide and moving blades from the manufactured embedding body.