| 摘要 |
PURPOSE:To facilitate boring work or the like and obtain a multilayer wiring board with a wide area by using a single-sided copper clad resin laminated board as a board. CONSTITUTION:A single-sided resin laminated board clad with copper foil 3 on a single side of an insulation resin laminated board 2 is used as a board 1. A copper clad 3 portion, which is not covered, is removed by an etching solution where an etching resist is further removed, thereby forming a first wiring conductor 4. An insulation layer 5 including a platinum element is formed on the surface of the first wiring conductor 4 and the insulation resin laminated board 2. On the surface is laminated a resin layer 6. After the formation of the resin layer 6, a hole 17 which penetrate the board 1 is installed therein. A plating resist layer 8 is formed on a spot which excludes the formation of a second insulator on the surface of the resin layer 6. The resin layer 6 which is not covered with the plating resist layer 8, is surface-roughened. After the surface roughening, it is electroless copper-plated, thereby forming a second wiring conductor 9, which is connected with the first wiring conductor 4. |
