发明名称 PROCESSING METHOD IN WIRE SAW DEVICE
摘要 PURPOSE:To ease a wire tension difference in an adjusting zone, to absorb the wire tension difference of a cutting zone, to make the wafer flatness of the work both end parts equal with a center part and to improve the yield, by winding a wire on a grooved roller at an adjusting zone, and making it non-contact with the member to be worked. CONSTITUTION:The length of a grooved roller 7 is made longer than, that of the member 9 to be worked, a wire is wound in multiple over the winding width larger than the length of the member 9 to be worked on these grooved rollers 7, and the adjusting zone of the wire tension is formed fore and aft of the winding width with only the wire of the medium part of the winding width being press-fitted to the member 9 to be worked. AS a result, the tension of the wire is increased at the press-fitting position, when the member 9 to be worked is press-fitted to the wire. However, this high wire tension is eased gradually at the adjusting zone fore and aft of the member 9 to be worked and approaches to the target value of a tension control system. So a large tension difference does not appear on the wire, at the border position of the wire coming into contact with the member 9 to be worked and that not coming into contact with.
申请公布号 JPH04135157(A) 申请公布日期 1992.05.08
申请号 JP19900254831 申请日期 1990.09.25
申请人 NIPPEI TOYAMA CORP 发明人 TAKEUCHI NORIYUKI;KOMI HISAYOSHI
分类号 B24B27/06;B23D57/00 主分类号 B24B27/06
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