| 摘要 |
PURPOSE:To provide a high quality hybrid integrated circuit with improved workability by providing a desired material quality prepreg for fixing a circuit board on an island of a metal lead frame. CONSTITUTION:A circuit board is fixedly mounted on an island 9 of a metal lead frame 8 by a hot press process using a prepreg 3 of the same material quality as that of the circuit board 2. Then, an active element 5 and a passive element 6 and the like are placed on a circuit pattern 1 of the circuit board 2 and bonded together with use of a bonding agent 10 for their mounting. Further, circuit connection is achieved using a metal fine line 4, etc., and is sealed using molding resin 7 to prepare a hybrid IC device. Hereby, workability is improved and characteristics of a circuit board material quality is kept intactly, and hence a high quality hybrid IC device is ensured. Further, the same effect is ensured even with use of a prepreg of the same material quality as that of a frame 8.
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