| 摘要 |
<p>PURPOSE:To attach a terminal pin to a package substrate even at a part where a semiconductor mounting part has been formed by a method wherein nearly the whole surface including the semiconductor mounting part on one face of the package substrate is covered with an insulating film. CONSTITUTION:A recessed part 14 at an insulating film 5 is fitted into a semiconductor mounting part 2 of a package substrate 1; outer-lead parts 16, 16,... protruding from the edges of the insulating film 5 are bonded to respective pads 13, 13,... of the package substrate 1 by using solder or the like; the insulating film 5 is bonded to the surface of the package substrate 1 by using resin adhesive and can be fixed to the package substrate 1. At the recessed part 14, a semiconductor chip 7 such as an IC is mounted on the semiconductor mounting part 2; wires 11 such as gold wires are bonded between the semiconductor chip 7 and inner-lead parts 15 of connecting circuits 6, 6,... formed on the insulating film 5. Thereby, the semiconductor chip 7 is connected to the connecting circuits 6, 6,.... Consequently, the semiconductor chip 7 is connected electrically to terminal pins 4 through circuits 12 formed on the package substrate 1 via the pads 13 from the connecting circuits 6.</p> |
