| 摘要 |
The circuit comprises several metal plates (A,B,C) onto each of which a chip (D,E,F) is soldered, the chips being connected together and to their respective rheophores (1,2.....9) by means of bonding wires. The plates and the other internal electrical components are reciprocally insulated by means of the resin which constitutes the encapsulation. |
| 申请人 |
SGS-THOMSON MICROELECTRONICS S.R.L., AGRATE BRIANZA, MAILAND/MILANO, IT |
发明人 |
PALARA, SERGIO, I-95026 ACI TREZZA CT, IT;PERNICIARO SPATRISANO, ANTONIO, I-90100 PALERMO PA, IT;PAPARO, MARIO, I-95037 SAN GIOVANNI LA PUNTA CT, IT;GIACALONE, PIETRO, I-91026 MAZARA DEL VALLO TP, IT |
