| 摘要 |
PURPOSE:To prevent occurrence of accidents such as falling off, breakage and peeling even when subjected to bending deformation by fitting a projected part formed by projection of a mold layer to nearly the same face with the surface of an outer cover layer to a window provided on the surface outer cover layer. CONSTITUTION:An IC unit 4 made by molding an IC chip 1 having built-in UV-EPROM with an ultraviolet-ray transmitting material is contained in a hole 6 provided in a card substrate 5, and the surface and back of the substrate are covered with outer cover layers 7, 9 made of a material that does not transmit ultraviolet rays. A window 10 is formed at a part right above the chip 1. A projected part 12 formed by projection of a part of a mold layer 8 to nearly the same face with the surface of the outer cover layer 9 is fitted to the window 10, and the window 10 is closed. When bending stress is applied to an IC card of such structure, concentration of stress does not take place at the corner part of the window 10, and breakage can be prevented. As there is no recessed part in the window 10, accumulation of dust and dirt does not occur. |
