发明名称 PROCESS FOR MAKING ELECTRICALLY CONDUCTIVE PATTERNS
摘要 A process for making an electrically conductive pattern on a substrate including forming a patterned adhesive layer on the substrate, applying a conductive metal powder to the adhesive layer, and in a second coating pass, applying a powder containing supplementary elements to the pattern. The patterned substrate is fired to volatilize theadhesive layer and sinter the powders. This process can be used to make printed circuits on ceramic substrates which are useful in hybrid circuits, for example.
申请公布号 US5110384(A) 申请公布日期 1992.05.05
申请号 US19900510316 申请日期 1990.04.17
申请人 E. I. DU PONT DE NEMOURS AND COMPANY 发明人 DUDEK, DIETMAR;PFEIFFER, THOMAS
分类号 G03F7/28;H01B1/02;H01B13/00;H05K1/03;H05K1/09;H05K3/10;H05K3/38 主分类号 G03F7/28
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