| 摘要 |
PURPOSE:To reduce the quantity of an adhering adhesive and prevent the dislocation of a chip to bond it with accuracy in positioning by providing the chip with an adhesive layer, and pressing the adhesive layer after positioning it while making it abut on a substrate. CONSTITUTION:An adhesive supplier 3 advances right below a chip holding means 5, which is holding a substrate 1. The means 5 falls right above the supplier 3, and the surface of a chip 4 is soaked in an adhesive 31, and it rises, and the surface of the chip 4 is coated with an adhesive layer 32. Then, the adhesive supplier 3 retreats. The substrate supporting table 2 retreats so that the region, where the chip 4 is mounted, of the substrate 1 may come right below the means 5. The means 5 falls, and it stops at the position where the surface of a layer 32 abuts on the specified position of the substrate 1. While detecting the position with a position detector 6, the table 2 is inched so that the substrate 1 may be positioned in the specified place. The means 5 falls vertically, and presses the bump 41 of the chip 4 so as to bond it. When the vacuum suction of the chip 4 is relieved and the means are elevated, the chip 4 is placed on the substrate 1 through the adhesive layer 32.
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