| 摘要 |
Prodn. of a protective resin layer on miniature integrated circuits or circuit elements n which a number of circuits are formed simultaneously. A coating of resin, pref. silicone resin, is applied over the completed wafer of devices and/or circuit elements the working parts of the devices are coated further with a masking layer, the remainder of the resin coating is removed and the devices separated. The protection is effective for the working regions and avoids the necessity for separate encapsulation in resins or boxes. |
