| 摘要 |
<p>PURPOSE:To make a power supply circuit or ground circuit as a low inductance circuit by forming a metallic plated layer without fail on the opposite parts of a radiating plate to recessions. CONSTITUTION:The title electrode part mounting substrate is provided with exposed recessions 4 striding over a basic member 10 and a radiating plate 2 while a bonding agent 3 is exposed in the same surface of the exposed recessions 4. Accordingly, the metallic plated layer coated on the rear surface of the basic member 10 is completely formed on the surface of the exposed recessions 4. Furthermore, since the metallic plated layer is continuously formed on the rear surface side of the radiating plate 2, the exposed recessions 4 and the basic member 10, no moisture can permeate into the basic member 10 from the rear surface side. Accordingly, the title electronic part mounting substrate having the high functions and excellent heat dissipation properties can be manufactured.</p> |
