DRY ETCHING METHOD USED FOR ALUMINUM FILM AND ETCHING DEVICE USED FOR SAID METHOD,申请号JP19900245464-传众专利搜索

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发明名称	DRY ETCHING METHOD USED FOR ALUMINUM FILM AND ETCHING DEVICE USED FOR SAID METHOD
摘要
申请公布号	JPH04124821(A)	申请公布日期	1992.04.24
申请号	JP19900245464	申请日期	1990.09.14
申请人	SONY CORP	发明人	KAMIIDE KOYO
分类号	C23F4/00;H01L21/302;H01L21/3065;H01L21/31;H01L21/3205;H01L23/52	主分类号	C23F4/00
代理机构		代理人
主权项
地址

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