| 摘要 |
1276102 Semi-conductor devices TELEFUNKEN PATENTVERWERTUNGS GmbH 1 Oct 1969 [1 Oct 1968] 48313/69 Heading H1K A manufacturing method for semi-conductor devices, particularly diodes, comprises forming contacts 4a on tongues of a contact-making strip 1, enclosing the contacts in housings 5, inserting semi-conductor bodies 6 into the housings and on to the contact 4a, and bringing contacts 4b, secured to other tongues of the same or a second contact strip 8, into contact with the body 6 to form a device. The structure may then be passed through a furnace 9, and under the influence of a weighting chain 10 ohmic contact between the body 6 and contacts 4a and 4b established. During the heating process, the housing 5, which may be a glass tube, is melted on to the contacts to form a vacuumtight seal. The tongues may be from two contact strips having a double comb structure, or be tongues on each side of a central web and folded over. The contacts may be of copper sheathed wire with a nickel core, the strip a gold or nickelplated sheet of an iron-cobalt-nickel alloy. The tongues may be severed from the strip and used as leads in printed circuits. |
