| 摘要 |
PURPOSE:To realize firm combination of enamel film and resin and suppress quench and defective cooling of superconductor lead due to peeling of resin from enamel film by infiltrating a resin into the surface of enamel film. CONSTITUTION:An insulated lead wire 11 is formed by covering a superconductor lead wire 12 with enamel film 13, thickness of the enamel film 13 is set to 3 to 100mum and phormal resin is used for the enamel film 13. The area between the adjacent insulated lead wires 11 is impregnated with a resin 14, which is thermally hardened. The resin 14 includes bisphenol type epoxy main agent, a hardening agent of acid anhydride, a hardening accelerator of third amine and other additives. The surface of enamel film 13 forms an impregnated part 15 by impregnation of resin 14 at the time of impregnation or hardening. Therefore, since enamel film 13 and impregnated part 15 and impregnated part 15 and resin 14 are respectively combined intensively, these will never be separated easily in the area near the superconductor lead 12. |
