| 摘要 |
A ceramics circuit board (5a) is manufactured by preliminarily preparing a circuit pattern base (3a) composed of a plurality of circuit pattern elements (1a,1b,1c,1d) connected by bridging pieces (2a) each having a thickness smaller than that of the circuit pattern element (1a,1b,1c,1d), preferably less than half thickness of the circuit pattern base (3a), applying and bonding the circuit pattern base (3a) onto one surface of a ceramics board base (5a) and removing the bridging pieces (2a) by effecting an etching treatment to thereby form a circuit pattern having a predetermined shape on the one surface of the ceramics board base (5a). The circuit pattern base (3a) and the bridging pieces (2a) are formed of one metallic plate by partially effecting etching treatment. The bridging pieces (2a) are arranged so as to have a gap between a rear surface thereof and the one surface of the ceramics board base when the circuit pattern base (3a) is applied on the one surface of the ceramics board base (5a). The bonding step may be carried out by forming, on a surface to be bonded, an eutectic material composed of the same metallic material as that composing the circuit pattern base and oxygen. It is preferred that the method further includes the step of applying and bonding a copper plate (4a) to another surface of the ceramics board base (5a) before the etching treatment. <IMAGE> |
