| 摘要 |
A semiconductor device comprises a semiconductor chip with an active surface having output bonding pads to which a plurality of conductive leads or finger contacts are attached via a TAB method and is packaged onto an insulating substrate having a pattern of conductors on its surface. The active surface of the semiconductor chip is initially coated with a first resin sealant comprising moldable resin agent containing a volatile solvent in the range of about 30% to 80% by volume, the solvent being soluble in the resin agent and having a volatility at a temperature below the thermosetting temperature of the resin agent. The semiconductor device is then mounted on the insulating substrate with the chip leads in aligned relation with at least some of the pattern conductors resulting in a cavity between the active circuit surface coated with the first resin sealant and the substrate surface. The mounted semiconductor device is then is encapsulated relative to its full peripheral extent with a second resin sealant comprising thermosetting epoxy resin having a viscosity permitting the filling of the cavity by capillary action while forming an environmentally impermeable coating. The method of packaging of this invention provides for a substrate mounted semiconductor device of reduced thickness and prevents deterioration due to continued thermal stress applied to the packaged structure during use resulting in finger lead cracking and moisture penetration into the packaged semiconductor device causing corrosive deterioration to that finger leads and their interconnects.
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