| 摘要 |
<p>PURPOSE:To enable sufficient bond on a board and direction regulation of electronic components at need, by dripping a specified amount of liquid drops of specified adhesive agent from a jet nozzle to specified positions on a printed board, drying and eliminating water content, mounting the electronic components on the adhesive agent and performing soldering. CONSTITUTION:Emulsion adhesive agent as thermoplastic adhesive agent is used. A specified amount of adhesive agent 6 is dripped on specified positions on the surface of a printed board one drop by one drop. The board 7 is passed a microwave dryer 8, and water content of the adhesive agent liquid drops 6 is eliminated and dried. The adhesive agent generates adhesion necessary to retain components. Electronic components 9 are mounted at specified positions, and pressed against the dried adhesive agent liquid drops 6, thereby ending the mounting of the preliminary fixing of the components. In the state of preliminary fixing, the directions of the components can be changed. When the board 7 is turned over, and the mounting side of the components 9 is brought into contact with fused solder, necessary connection and fixing between external electrodes 9' of the components 9 and a printed wiring 7' on the board 7 are completed.</p> |
