| 摘要 |
PURPOSE:To reduce the size of a package by forming a chip wherein the circuit function of a semiconductor device is divided into two chips, and sealing said chips which are stacked in the same package. CONSTITUTION:The title semiconductor device is formed by dividing a chip constituting a circuit into two chips, and sealing the divided chips which are stacked. Thereby a chip size is restrained and the defective rate can be decreased. Since the package size is reduced, the mounting area can be made small. |
