| 发明名称 |
INTEGRATED CIRCUIT PACKAGE |
| 摘要 |
<p>Damage caused by excess die attach material 23 is prevented by providing a channel 24 for the excess to flow into. Channel 24 is located about at least a portion of an area 21 where a die 22 is to be attached. <IMAGE></p> |
| 申请公布号 |
SG21192(G) |
申请公布日期 |
1992.04.16 |
| 申请号 |
SG19920000211 |
申请日期 |
1992.03.04 |
| 申请人 |
MOTOROLA INC. |
发明人 |
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| 分类号 |
H01L21/58;H01L23/13;(IPC1-7):H01L23/12 |
主分类号 |
H01L21/58 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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