ATTACHMENT MECHANISM FOR NONWOVEN THERMOFORMED ARTICLES

摘要

A device and method for attaching thermoformed substrate material (10) havin g front and back surfaces to a support frame are disclosed. The device includes a fastener (16) having a base porti on (90) and an attachment portion (22) projecting from the base portion for engagement with the support frame. An adhesive mechanism secures the base portion to the substrate. The adhesive mechanism is thermoplastic and heat activatable at thermoformin g temperatures prior to bonding and has a suffi- ciently high softening point after bonding to prevent flow at temperatures o f up to about 250 .degree.C. The adhesive mechanism in the form of a nonwoven, needle-punched fiber sheet having an enriched surface of lower melting point fiber or an effective amount of a hot melt adhesive adopted for reactivation at thermoforming temperature s.