发明名称 CUTTING WORK PROCESS OF TRANSPARENT MATERIAL
摘要 PURPOSE:To carry out a cutting work on a transparent material into a complex configuration by radiating a high energy beam, which is not absorbed into the transparent material, inside of the transparent material while focusing the beam. CONSTITUTION:A high energy beam, which is not absorbed into a transparent material, is radiated inside of the transparent material through an optical system constituted from lenses or mirrors while focusing the high energy beam. Thereby, an extremely small crack of not more than several ten microns is generated at a point where the high energy beam has been radiated. While moving the radiating position by this high energy beam, the consecutive crack is generated in the transparent material so that a cutting work on the transparent material can be carried out.
申请公布号 JPH04111800(A) 申请公布日期 1992.04.13
申请号 JP19900229891 申请日期 1990.08.31
申请人 NIHON SEKIEI GARASU KK;YAMAGUCHI NIHON SEKIEI KK 发明人 KUZUU SHIN
分类号 B26F3/00;B23K26/00;C03B33/00 主分类号 B26F3/00
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