| 摘要 |
PURPOSE:To enable conduction inspection of a multilayer printed-wiring board which does not have a conductor within a through-hole to be executed easily by forming a through-hole for inspecting conduction at an inspection region and at the same time by forming a connection pattern for connecting a circuit pattern edge part and the through-hole for inspecting conduction. CONSTITUTION:A through-hole 15 for inspecting conduction is formed at an inspection region 14 at a peripheral part of a circuit pattern forming region 13, a connection pattern 16 for connecting this through-hole 15 for inspecting conduction and a circuit pattern edge part 11 is provided, and then conduction inspection between the circuit pattern edge part 11 and the through-hole 15 for inspecting conduction is performed. After that, the connection pattern 16 is cut off and at the same time the inspection region 14 is separated from the circuit pattern formation region 13, thus enabling conduction inspection of a multilayer printed-wiring board 1 with special specifications without having the through-hole conductor to be performed easily and positively. |
