| 摘要 |
PURPOSE:To offset the height of heated area with the thickness of the chip and make possible a reduction in wire loop height by bonding the wire to the substrate using a capillary to press down on a ball formed on the bottom tip of the wire by electric spark and while bending the wire from the upper heated section, using the same capillary to bond the wire to the chip. CONSTITUTION:Ball bonding is performed by using the capillary 3 to press the ball 5 onto the substrate 1. After the capillary 3 is lifted vertically, it is moved down again to perform stitch bonding of the wire 4 to the upper surface of the chip 2. Next, the wire is cut at the spot of bonding and the capillary is lifted. Since the rigidity of the heated section 4a changes with heating, when the capillary 3 is moved downward to the chip 2 in a circular arc from the position directly above the ball 5, the wire 4 bends from the upper section 4b of the heated section 4a. In this way, it is possible to achieve a low wire loop h1 to the surface of chip 2. |
