| 摘要 |
A circuit (10) and a method of making same utilize a plurality of generally planar diamond substrate layers (20). Electronic circuit elements (210) are mounted on each of the substrate layers (20), and the substrate layers are disposed in a stack. Heat exchange means (90) can be coupled generally at the edges of the substrate layers (20). In a disclosed embodiment, a multiplicity of generally planar diamond substrate layers (20) and a multiplicity of generally planar spacer boards (30) are stacked in alternating fashion so that spacer baords (30) are interleaved between adjacent substrate layers. Each of the substrate layers (20) has mounted thereon a multiplicity of electronic elements (210) which may comprise integrated circuit chips and conductive means for coupling between electronic elements. Each of the spacer boards (30) has a multiplicity of electrical conductors (38) extending through its planar thickness to effect coupling between electronic components on the substrate layers (20) on its opposing sides. The extremely high thermal conductivity of diamond permits adequate heat removal from the defined three-dimensional circuit structure (10) by heat exchange means (90) that do not substantially interfere with electronic element density, with vertical interconnect density, or with the desire for small physical size. <IMAGE> |
