PROCESS FOR SURFACE TREATMENT BY PLASMA OF A SUBSTRATE SUPPORTED BY AN ELECTRODE

摘要

This invention relates to a process for surface treatment of a substrate carried by an electrode and immersed in a sealed engraving or deposition chamber equipped with plasma generating means, of the type involving the application to the electrodes, of a variable voltage, produced by a generator that is independent of the plasma generating means, wherein said process comprises the steps of: maintaining within said chamber a continuous plasma that is free of electromagnetic fields; supplying said electrode via a low impedance capacitor using a signal comprised of rectangular voltage pulses having: a variable pulse repetition rate to control the energy distribution function of the positive ionic charges bombarding the substrate, a variable mark-to-space ratio for each pulse to control the time distribution of the negative electron charges and the positive ionic charges bombarding the substrate, and a variable pulse amplitude to control the energy of the positive ionic charges bombarding the substrate.