| 摘要 |
PURPOSE:To reduce pad pitch as compared with conventional devices, and restrict the increase of chip area coming from the increase of the number of terminals, by using a package provided with a front row inner lead and a rear row inner lead, and using a TAB system together with a wire bonding system. CONSTITUTION:The following are provided; a package 1a having a front row inner lead 3a and a rear row inner lead 2a, an IC chip 6a mounted on an island part of a package la, leads 5-1, 5-2,... which connect pads 8-2, 8-4,... of the IC chip 6a and the front row inner lead 3a by a TAB system, and bonding wires 4-1, 4-2,... which connect the other pads 8-1, 8-3,... of the IC chip 6a and the rear row inner lead 2a. For example, IC chip 6a is so designed that the connection by wire bonding is not continued more than or equal to two pads. Bumps 7-1, 7-2,... are previously formed on the pad 8-2, 8-4,... which are electrically connected by TAB bonding. |
