HEAT SINK MOUNTING TYPE SEMICONDUCTOR DEVICE,申请号JP19900221548-传众专利搜索

首页产品黄页商标征信

会员服务注册登录

法人/股东/高管

发明名称	HEAT SINK MOUNTING TYPE SEMICONDUCTOR DEVICE
摘要
申请公布号	JPH04103153(A)	申请公布日期	1992.04.06
申请号	JP19900221548	申请日期	1990.08.23
申请人	NEC CORP	发明人	MIZUNASHI HARUMI
分类号	H01L23/40	主分类号	H01L23/40
代理机构		代理人
主权项
地址

您可能感兴趣的专利

Modular pressure control and drilling waste management apparatus for subterranean borehole

Vehicle fuel management system

Gas cooling methods for high pressure fuel storage tanks on vehicles powered by compressed natural gas or hydrogen

Mobile communications system

Method and apparatus for reducing laser speckle

Color display device and driving method thereof

Image projection apparatus for adjusting white balance in consideration of level of light emitted from LED and method thereof

Two stage grease gun

Method for controlling precharge timing of memory device and apparatus thereof

Microwavable metallic container

Amorphous silicon thin film transistor-liquid crystal display device and method of manufacturing the same

Method and system for automating the creation of customer-centric interfaces

Multifocal ophthalmic lens

Workflow for processing streamer seismic data

Semiconductor component and corresponding fabrication/mounting method

Copy protection without non-volatile memory

Method and apparatus for setting speed/response performance parameters of a power driven wheelchair

Mask defect inspection apparatus

Liquid crystal display and electro-optical devices with a function element

Integrated stress relief pattern and registration structure