摘要 |
<p>An expandable holding device for holding a component (115) in which the clamping force is brought about by the solidification and expansion of a fusible alloy (132). The alloy (132) is contained in an expansion chamber (130) defined in part by a thin-walled, expansion sleeve (122). The alloy (132) has a low melting point and expands when it solidifies. The pressure caused by expansion of the fusible alloy radially expands the expansion sleeve (122) causing the expansion sleeve to grip the component (115). To release the component, the alloy (132) is heated and liquified so that the expansion sleeve (122) returns to an unexpanded condition.</p> |