| 发明名称 |
Direct bonded symmetric-metallic-laminate/substrate structures |
| 摘要 |
A composite structure comprising a symmetric bimetallic laminate bonded to a separate substrate is provided by eutectic bonding the bimetallic laminate to the substrate. A variety of beneficial structures can be provided.
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| 申请公布号 |
US5100740(A) |
申请公布日期 |
1992.03.31 |
| 申请号 |
US19910777495 |
申请日期 |
1991.10.15 |
| 申请人 |
GENERAL ELECTRIC COMPANY |
发明人 |
NEUGEBAUER, CONSTANTINE A.;BURGESS, JAMES F.;GLASCOCK, II, HOMER H. |
| 分类号 |
B23K35/00;C04B37/02;H01L21/48;H01L23/492;H01L23/498 |
主分类号 |
B23K35/00 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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