| 摘要 |
PURPOSE:To improve the adhesive property of the copper surface of a copper- lined laminated board or the like to a resin-base material such as prepreg by treating the copper surface with a soln. having a prescribed composition contg. a heterocyclic compound contg. nitrogen. CONSTITUTION:When a printed circuit board for an inner layer or the like is manufactured, the copper surface of a copper-lined laminated board or the like is roughened and immersed in a treating soln. prepd. by adding about 1-500mg/ lheterocyclic compound contg. nitrogen such as 4,7-dimethyl-1,10-phenanthroline to copper ions, a complexing agent, a reducing agent, hydroxyl ions and water as essential components. By the treatment, the copper surface is colored, in a color other than the colors of metallic copper and lustrous metallic copper. The adhesive property of the copper surface to a resin-based material such as prepreg is improved, and a printed circuit board for an inner layer giving an inner layer circuit with superior line accuracy is obtd. |
