| 摘要 |
PURPOSE:To manufacture an insulating substrate including a thick circuit pattern inexpensively with higher dimensional accuracy by preparing a metal pattern plate including in integration a body part formed to be relatively thicker and a connection part formed to be relatively thinner, and fixing the metal pattern plate onto an insulating film and removing the connection part. CONSTITUTION:An insulating film 2 is formed by applying epoxy resin on the entire upper surface of a metal flat plate 1. Prior to curing of the epoxy resin a metal pattern plate 10 is positioned and placed on the insulating film 2. A resist layer 3 is formed by patterning a resist on the entire upper surface of the same. Connection parts 12, 13 are etched and removed with the resist layer 3 taking as a mask, and thereafter the resist layer 3 is removed to yield a circuit pattern P including only body parts 11a-11c. |
